Laser Marker for metal meterials,Laser Engraving Machine,Laser Marking Machine.
Semiconductor pump laser use semiconductor light-emitting diode as the energy source (excitation) of laser crystals, pumping the ND: YAG dielectric with it in the wavelength of 808nm to generate a large number of reversed particles, under the function of the Q-switch to produce giant pulse laser which wavelength is 1064nm. The electro-optical conversion rate of semiconductor laser has improved greatly compared to the lamp pump laser, which avoid using bulky auxiliary equipment resulted in high heat, poor quality of the laser beam etc. It represents the second generation laser.
The marker is designed according to ergonomics, providing beautiful appearance and simple operation. All the important optic parts are imported from Europe and America. The optics system is in fully sealed structure. It has optics preview and focus indication function and provides reliable security for the 24-hour continuous working of the machine.
Features:
●High stability
The semiconductor pump laser marking system uses semiconductor technology to replace traditional electro vacuum technology and the excitation source uses high power semiconductor matrix, extending the service life of the product and system stability significantly.
● High precision
The output beam of semiconductor pump laser marking system is closer to ideal mode and is more suitable for hyperfine process. The minimum character size is 0.2nm, making the precision of the laser marking reach a new order of magnitude.
● High speed
The semiconductor pump laser marking system uses hyperfine optic devices and its galvanometer speed is much higher than traditional laser system.
● Low energy consumption
The semiconductor laser marking system uses highly efficient semiconductor matrix, improving the laser conversion efficiency significantly.
● High reliability
The semiconductor laser marking system is highly integrated and no high voltage power supply or high voltage device is required, ensuring the reliability of the system.
● Small size
The highly integrated control system allows customers to make better use of the plant space.
The semiconductor pump laser marking system uses semiconductor technology to replace traditional electro vacuum technology and the excitation source uses high power semiconductor matrix, extending the service life of the product and system stability significantly.
● High precision
The output beam of semiconductor pump laser marking system is closer to ideal mode and is more suitable for hyperfine process. The minimum character size is 0.2nm, making the precision of the laser marking reach a new order of magnitude.
● High speed
The semiconductor pump laser marking system uses hyperfine optic devices and its galvanometer speed is much higher than traditional laser system.
● Low energy consumption
The semiconductor laser marking system uses highly efficient semiconductor matrix, improving the laser conversion efficiency significantly.
● High reliability
The semiconductor laser marking system is highly integrated and no high voltage power supply or high voltage device is required, ensuring the reliability of the system.
● Small size
The highly integrated control system allows customers to make better use of the plant space.
Suitable materials and application
Carve metal and nonmetal materials; more suitable for circumstances that require super fine and high precision.
It is applied to electronic components, integrated circuit (IC), electric apparatus, mobile communication, hardware products, tool fittings, precision instrument, glasses, watch and clock, jewelry, automobile parts, plastic keys, construction materials, PVC pipes, medical instruments, etc.
Suitable materials include: common metal and alloy (all metals include iron, copper, aluminum, magnesium and zinc), rare metal and alloy (gold, nickel, and titanium), metal oxide, special surface process (phosphating, aluminum anodizing and electroplated surface), ABS material (electric apparatus shell, daily necessities), ink (light-transmitting keys, printing products), epoxy resin (packages and insulating layer of electronic components).
It is applied to electronic components, integrated circuit (IC), electric apparatus, mobile communication, hardware products, tool fittings, precision instrument, glasses, watch and clock, jewelry, automobile parts, plastic keys, construction materials, PVC pipes, medical instruments, etc.
Suitable materials include: common metal and alloy (all metals include iron, copper, aluminum, magnesium and zinc), rare metal and alloy (gold, nickel, and titanium), metal oxide, special surface process (phosphating, aluminum anodizing and electroplated surface), ABS material (electric apparatus shell, daily necessities), ink (light-transmitting keys, printing products), epoxy resin (packages and insulating layer of electronic components).
Technical parameters
|
Model |
M50DSPY |
|
Laser Output Power |
≤50W |
|
Laser wavelength |
1064nm |
|
Light beam mass m2 |
<3 |
|
Laser repeating frequency |
≤50KHz |
|
Laser module lifetime |
>13000 hours |
|
standard carving range |
70mmX70mm |
|
optional carving range |
110mmX110mm/145mmX145mm/175mmX175mm(optional) |
|
Carving depth |
0.01mm-0.2mm |
|
integrity power |
2.5KW |
|
Minimum line width |
0.01mm |
|
Repeating precision |
±0.003mm |
|
carving line speed |
≤7000mm/s |
| Dimensions | |
|
cooling system |
Water-cooling |